GM5BW97331A【PDF 14/18 页】LED WHITE 5000K 20MA 3.2V PLCC4

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Preliminary

GM5BW97331A

?SPAN class="pst GM5BW97331A_2663707_3">Design Notes

1. Do not allow the circuit to apply any reverse voltage to the LEDs at any time, operating or not. Do not bias this

part in any manner when it is not operating. Reverse voltage can also be induced via EMF, generated by ambi-

ent light falling on this part. When these parts are operated in series, connect a zener diode parallel to each part

to protect them from reverse voltage.

2. This part can be damaged by mechanical stress. Be certain that assembly steps do not stress this part; pay

particular attention to pick-and-place equipment. Verify placing pressure and do not allow the collet to contact

the resin of this part.

3. This product uses blue LED chips in combination with yellow phosphor to achieve its color. There may be some

slight color change due to afterglow of the phosphor when driving this part with pulsed power.

4. This part has a high light output. Looking directly at it during full power output may cause injury.

5. Sharp recommends taking proper personal and environmental static control precautions when handling this part.

6. This device incorporates thermally conductive materials to allow heat to be transferred from it to the circuit

board. For best reliability, do not locate other sources of heat near the LED, and design the circuit board for

effective heat dissipation. Keep the parts case temperature under 100癈 (LED ON) including self-heating.

7. Handle these parts in a clean environment; dust may be difficult to remove and can affect optical performance.

8. Confirm the parts performance, reliability, and resistance to degradation, if exposing it to these environments:

"Direct sunlight, outdoor exposure, dusty conditions

"In water, oil, medical fluids, and organic solvents

"Excessive moisture, such as dew or condensation

"Corrosive (salt) air or corrosive gases, such as Cl, H

S, NH

, SO

, NO

?SPAN class="pst GM5BW97331A_2663707_3">Manufacturing Guidelines

?SPAN class="pst GM5BW97331A_2663707_3">Storage and Handling

1. Moisture-proofing: These parts are shipped in vacuum-sealed bags to keep them dry and ready for use.

See Fig. 18.

2. Store these parts between 5癈 and 30癈, at a relative humidity of less than 70%; for no more than one year

from the production date.

3. After breaking the package seal, maintain the environment within 5癈 to 30癈, at a relative humidity of less than

60%. Solder the parts within 3 days.

4. If the parts will not be used immediately, repack them in a dry box, or re-vacuum-seal them with a desiccant.

5. If the parts are exposed to air for more than 3 days, or if the silica gel telltale indicates moisture contamination,

bake the parts:

"When in the tape carrier, bake them at a temperature of 95癈 to 100癈, for 16 to 24 hours.

"When loose or on a PCB, bake them at a temperature of 110癈 to 120癈, for 8 to 12 hours.

"Note that the reels may become distorted if they are in a stack when baking. Confirm that the parts have cooled

to room temperature after baking.

?SPAN class="pst GM5BW97331A_2663707_3">Cleaning Instructions

1. Sharp does not recommend cleaning printed circuit boards containing this device, or cleaning this device with

ultrasonic methods. Process chemicals will affect the structural and optical characteristics of this device.

2. Sharp recommends the use of a solder paste that does not require cleaning.

3. Do not clean this part ultrasonically.

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